Chinese tech giants SMIC and Huawei have made significant progress in semiconductors in recent years, but U.S. sanctions mean they remain 10-15 years behind leading chipmakers such as Intel, TSMC and Samsung.
According to reports, these remarks were made by Christopher Fouquet, CEO of ASML Europe and the world's leading wafer tool manufacturer. Tom's Hardcorewhich quotes an interview he gave national research council in the Netherlands.
“By banning EUV exports [extreme ultraviolet lithography machines]China will lag behind the West by 10 to 15 years. It does have an effect,” he said.
According to the report, even if China's largest chipmaker SMIC has ASML's best deep ultraviolet (DUV) machine capable of producing 5nm to 7nm wafers, it cannot match Taiwan's TSMC because it cannot obtain leading EUV machine.
“However, the main concern is not that Chinese companies may develop their own EUV lithography tools in about 15 years, but that they may copy ASML's mainstream DUV machines (such as Twinscan NXT:2000i) in the next few years,” said.
read Full Report: Tom's Hardware.
See also:
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